Ghodssi has been selected as chair for the 2009 Microfabrication, Integration and Packaging Conference

Associate Professor Reza Ghodssi (ECE/ISR) has been selected as chair for the Microfabrication, Integration and Packaging Conference at the 2009 DTIP symposium to be held April 1-3, 2009 in Rome, Italy. The Microfabrication, Integration and Packaging Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.